HK-MOLD-L&B芯片封合模具

产品名称：HK-MOLD-L&B芯片封合模具

产品组成：芯片上盖模具和芯片管壳模具

独特优势：对芯片盖子Lid和芯片主体（管壳）Body进行精准定位；配合封装系统等温导热，恒温控制；可根据客户的产品尺寸规格，进行个性化定制。

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Product Name: HK-MOLD-L&B Chip Sealing Mold

Product Composition: Chip upper cover mold and chip package shell mold

Unique Advantages:

• Precise positioning of the chip lid and the chip body (package shell).
• Isothermal heat conduction and constant temperature control in cooperation with the packaging system.
• Personalized customization based on the product size specifications of the customer.

Business Inquiry:

Sales Manager: Liu Rongfu Mobile: 13929965156
Sales Manager: Lu Jianrong Mobile: 13929965158
Sales Manager: Liu Xifa Mobile: 13928506745