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系统名称：佛大华康科技FDHK-ISS芯片管壳封装整体解决方案(FDHK Isothermal Sealing Solution)
主要组成：包含定制化芯片管壳、带胶树脂盖或陶瓷盖、芯片管壳封装设备组成。
独特优势：提供精密管壳、带胶树脂盖、芯片管壳封装设备和工艺整体解决方案，提高芯片一致性和成品率。
（环氧密封封装解决方案，包含材料开发、定制化环氧树脂、封装设计、密封工艺、恒温等温设备）
业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745
System Name: FDHK-ISS Chip Package Shell Encapsulation Solution (FDHK Isothermal Sealing Solution) from Fudahuakang Technology
Main Components: Customized chip package shells, adhesive resin caps or ceramic caps, and chip package shell encapsulation equipment.
Unique Advantages: Provides a comprehensive solution including precision package shells, adhesive resin caps, chip package shell encapsulation equipment, and processes, enhancing chip consistency and yield.
(Epoxy sealing solution, including material development, customized epoxy resin, packaging design, sealing processes, and constant temperature isothermal equipment)
Business Inquiry:
Sales Manager: Liu Rongfu Mobile: 13929965156
Sales Manager: Lu Jianrong Mobile: 13929965158
Sales Manager: Liu Xifa Mobile: 13928506745