半导体热沉基材自动送料轧制机

关键技术
1、批量储放基材、机械手取料定位、自动精准送料、自动轧制、机械手成品码垛
2、ASK-Designer4.0数字化软件集成技术、工业互联网技术、MES制造执行系统集成技术、设备远程诊断与维护管理技术、远程软件升级技术

典型应用
热沉CPC基材材料批量放料、自动送料、自动轧制工艺

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Key Technologies:

1.Batch Storage and Handling of Substrate Materials, Robotic Arm Material Retrieval and Positioning, Automatic Precision Feeding, Automatic Rolling, Robotic Arm Finished Product Stacking.
2.ASK-Designer4.0 Digital Software Integration Technology, Industrial Internet Technology, MES Manufacturing Execution System Integration Technology, Remote Equipment Diagnosis and Maintenance Management Technology, Remote Software Upgrading Technology.

Typical Applications:

Batch Material Loading, Automatic Feeding, and Automatic Rolling Processes for Thermal Sink CPC Substrate Materials

Business Inquiry:

Sales Manager: Liu Rongfu  Mobile: 13929965156

Sales Manager: Lu Jianrong  Mobile: 13929965158

Sales Manager: Liu Xifa  Mobile: 13928506745