半导体热沉基材折弯压合机

关键技术
1、铜基储料、机械手自动取料、自动折弯、机械手自动放钼基材料、自动压合、成品自动堆叠、自动传输
2、ASK-Designer4.0数字化软件集成技术、工业互联网技术、MES制造执行系统集成技术、设备远程诊断与维护管理技术、远程软件升级技术

典型应用
热沉CPC等散热材料自动折弯、压合

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Key Technologies:

1.Copper-Based Material Storage, Automatic Material Retrieval by Robotic Arm, Automatic Bending, Automatic Placement of Molybdenum-Based Material by Robotic Arm, Automatic Lamination, Automatic Stacking of Finished Products, Automatic Transmission.
2.ASK-Designer4.0 Digital Software Integration Technology, Industrial Internet Technology, MES Manufacturing Execution System Integration Technology, Remote Equipment Diagnosis and Maintenance Management Technology, Remote Software Upgrading Technology.

Typical Applications

Automatic Bending and Lamination of Heat Sink CPC and Other Thermal Materials

Business Inquiry:

Sales Manager: Liu Rongfu  Mobile: 13929965156

Sales Manager: Lu Jianrong  Mobile: 13929965158

Sales Manager: Liu Xifa  Mobile: 13928506745