芯片管壳上盖|封帽等温封装设备

关键技术
1、批量精密封装技术、AI人工智能精密温度控制系统、智能闭环柔性压力控制系统技术、智能配方调用与存储功能
2、ASK-Designer4.0数字化软件集成技术、工业互联网技术、MES制造执行系统集成、设备远程软件升级技术、历史追溯数据库技术

典型应用
各类型芯片管壳封装：射频与微波、电源管理、放大器、电机驱动器、逻辑电压转换、隔离、接口、数据转换、时钟和计时、音频、放大器、传感器、开关与多路复用器、无线连接等芯片

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Key Technologies：

1.Batch Precision Packaging Technology, AI Precision Temperature Control System, Smart Closed-Loop Flexible Pressure Control System Technology, Smart Recipe Invocation and Storage Function.

2.ASK-Designer4.0 Digital Software Integration Technology, Industrial Internet Technology, MES Manufacturing Execution System Integration, Remote Software Upgrade Technology for Equipment, Historical Traceability Database Technology.

Typical Applications：

Encapsulation of various types of chip packages: RF and microwave, power management, amplifiers, motor drivers, logic voltage converters, isolation, interfaces, data converters, clocks and timers, audio, amplifiers, sensors, switches and multiplexers, wireless connectivity, and other chips.

Business Inquiry:

Sales Manager: Liu Rongfu Mobile: 13929965156
Sales Manager: Lu Jianrong Mobile: 13929965158
Sales Manager: Liu Xifa Mobile: 13928506745