佛山市佛大华康科技有限公司简介
佛山市佛大华康科技有限公司，简称佛大华康科技，成立于2005年，位于广东省佛山市。作为一家拥有自主知识产权的高新技术企业，我们专注于先进制造业——智能装备领域的研发和生产。
一、公司背景与实力
佛大华康科技的主要创始人为业内高级工程师、佛山市科技创新杰出青年。我们拥有157项智能制造相关的发明、实用新型专利、软件著作、版权。作为国家高新技术企业，公司在广东股交中心科技板挂牌，并荣获佛山科技领军企业、专精特新企业等众多称号。
二、核心产品与服务
核心产品包括半导体芯片管壳封装设备、热密封设备、管壳自动上下料装备、芯片管壳封装装备、超声波|高频焊接设备、管壳组装冶具、晶圆|镜片精密测量设备、制冷芯片封边设备、专业非标机械、自动化智能生产线等定制化智能装备。公司掌握相关核心器件人机界面、PLC、节能型驱动器、变频器、智能仪表、数据采集智慧单元等工业自动化电气产品技术。特别是在半导体行业，我们提供ACP/ACC空腔封装设计、材料开发、定制密封工艺、智能封装设备等整体解决方案。
三、技术实力与解决方案
佛大华康科技通过19年的自动化工艺经验积累，能为半导体ACP/ACC空腔管壳封装提供一站式的服务。我们的智能等温封装设备及其智能工艺，解决用户封装管壳上盖产品一致性、统一性和质量问题。此外，我们提供预置B-Stage带胶盖板和代工点胶服务，满足用户批量生产的需求。
四、市场定位与发展方向
我们的市场定位主要是服务于半导体行业自动化设备及ACP封装的整体解决方案。面对行业的挑战，我们将不断普及LCP盖板、B-Stage胶水工艺、等温封装设备及其工艺，推动国内半导体产业圈的发展。未来，我们将扩大生产规模，提升生产能力，并加强与生态圈合作伙伴的合作，共同推动半导体封装工艺的发展。
五、企业文化与社会责任
我们秉持创新精神，致力于为客户提供高质量的产品和服务。我们注重人才培养和团队建设，激励员工发挥潜能，共同为公司的长远发展努力。同时，我们积极履行社会责任，疫情期间积极响应政府号召，调动技术力量参与相关应急装备的研发生产交付，并获得相关抗疫荣誉，关注环保与可持续发展，努力为社会作出积极贡献。
结语，佛山市佛大华康科技有限公司作为一家拥有强大研发实力和实战经验的高新技术企业，致力于推动智能装备领域的发展。我们将继续秉持创新精神，不断提升产品质量和服务水平，为全球客户提供卓越的解决方案，共创美好未来。
业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745
Company Background and Strength:
The main founders of FodaHuakang Technology are senior engineers and outstanding young innovators in science and technology in Foshan. We possess 157 patents related to intelligent manufacturing, including inventions, utility models, software copyrights, and more. As a national high-tech enterprise, we are listed on the Guangdong Equity Exchange Technology Board and have received numerous accolades, including being recognized as a leading enterprise in Foshan’s science and technology and a specialized new enterprise.
Core Products and Services:
Our core products encompass customized intelligent equipment, including semiconductor chip encapsulation equipment, refrigeration chip edge-sealing equipment, and related energy-efficient drivers, inverters, smart meters, and data acquisition smart units in the industrial automation and electrical products sector. Particularly in the semiconductor industry, we offer comprehensive solutions such as ACP/ACC cavity packaging design, material development, customized sealing processes, and intelligent packaging equipment.
Technical Strength and Solutions:
With 18 years of experience in automation processes, FodaHuakang Technology provides end-to-end services for semiconductor ACP/ACC cavity encapsulation. Our intelligent isothermal packaging equipment and processes address issues related to the consistency, uniformity, and quality of user-encapsulated shell covers. Additionally, we offer pre-set B-Stage adhesive covers and contract dispensing services to meet the demands of users in mass production.
Market Positioning and Development Direction:
Our market positioning primarily revolves around providing overall solutions for automation equipment in the semiconductor industry and ACP encapsulation. Faced with industry challenges, we aim to popularize LCP covers, B-Stage adhesive processes, isothermal packaging equipment, and related processes, contributing to the development of the domestic semiconductor industry. In the future, we plan to expand production scale, enhance production capacity, and strengthen cooperation with ecosystem partners to collectively advance semiconductor encapsulation processes.
Corporate Culture and Social Responsibility:
Guided by an innovative spirit, we are committed to delivering high-quality products and services to our customers. We prioritize talent development and team building, motivating employees to unleash their potential and contribute to the company’s long-term development. Simultaneously, we actively fulfill our social responsibility by focusing on environmental protection and sustainable development, striving to make a positive contribution to society.
Conclusion:
FodaHuakang Technology Co., Ltd., located in Foshan, as a high-tech enterprise with robust research and development capabilities and practical experience, is dedicated to propelling the development of intelligent equipment. Upholding an innovative spirit, we will continue to enhance product quality and service levels, providing outstanding solutions for global customers and jointly creating a better future.
