半导体热沉叠料分离机

关键技术
1、原料存储、机械手自动取料、叠粘材料分离、机械手取成品
2、CPC等热沉材料堆叠烧成后分离技术
3、自动检测材料厚度，自动分离
4、ASK-Designer4.0数字化软件集成技术、工业互联网技术、MES制造执行系统集成技术、设备远程诊断与维护管理技术、远程软件升级技术

典型应用
热沉CPC散热材料叠合后自动分离设备

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Key Technologies:

1.Raw Material Storage, Automatic Material Retrieval by Robotic Arm, Laminated Material Separation, Robotic Arm for Finished Product Retrieval
2.Separation Technology for Stacked and Fired Thermal Materials such as CPC
3.Automatic Material Thickness Detection and Automatic Separation
4.ASK-Designer4.0 Digital Software Integration Technology, Industrial Internet Technology, MES Manufacturing Execution System Integration Technology, Remote Equipment Diagnosis and Maintenance Management Technology, Remote Software Upgrading Technology

Typical Applications:

Automatic Separation Equipment for Laminated Thermal CPC Materials

Business Inquiry:

Sales Manager: Liu Rongfu Mobile: 13929965156

Sales Manager: Lu Jianrong Mobile: 13929965158

Sales Manager: Liu Xifa Mobile: 13928506745