半导体热沉基材磨边机

关键技术
1、半导体基材批量伺服数字化精密磨边
2、ASK-Designer4.0数字化软件集成技术、工业互联网技术、MES制造执行系统集成技术、设备远程诊断与维护管理技术、远程软件升级技术

典型应用
材料自动磨边、倒角、抛光、磨平等

业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745

Key Technologies:

1.Batch Servo Digital Precision Edging for Semiconductor Substrates.
2.ASK-Designer4.0 Digital Software Integration Technology, Industrial Internet Technology, MES Manufacturing Execution System Integration Technology, Remote Equipment Diagnosis and Maintenance Management Technology, Remote Software Upgrading Technology.

Typical Applications:

Automatic Material Edging, Chamfering, Polishing, and Grinding

Business Inquiry:

Sales Manager: Liu Rongfu  Mobile: 13929965156

Sales Manager: Lu Jianrong  Mobile: 13929965158

Sales Manager: Liu Xifa  Mobile: 13928506745