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设备名称：HK-ICTC5000W芯片管壳封装设备
主要用途：主要用途为将绑定好芯片的管壳与带胶树脂盖（或陶瓷盖）进行精密的等温恒温封合。
应用场合：应用于各类型芯片管壳封装–如射频与微波、电源管理、放大器、电机驱动器、逻辑电压转换、隔离、接口、数据转换、时钟和计时、音频、放大器、传感器、开关与多路复用器、无线连接等芯片管壳封装。
独特优势：通过佛大华康科技HK-ICTC5000W芯片管壳封装设备的精密控制工艺专利技术、精密等温控制专用系统、封装过程智能追溯系统，有效的管控溢胶、炸胶、漏气等问题，提高封装芯片的一致性和成品率高。
权威认证：佛大华康科技芯片管壳封装设备关键技术获第三方鉴定机构鉴定为国内领先水平，部份功能达到国际先进水平。
业务咨询：
销售经理：刘荣富 手机：13929965156
销售经理：卢建荣 手机：13929965158
销售经理：刘喜发 手机：13928506745
Equipment Name: HK-ICTC5000W Chip Package Shell Encapsulation Machine
Main Purpose: The main purpose of this equipment is to perform precise isothermal sealing of chip package shells with glued resin caps (or ceramic caps) after the chips have been bonded.
Applications: It is applicable for encapsulating various types of chip package shells such as those used in radio frequency and microwave, power management, amplifiers, motor drivers, logic voltage converters, isolation, interfaces, data converters, clocks and timers, audio, sensors, switches and multiplexers, and wireless connections.
Unique Advantages: The HK-ICTC5000W Chip Package Shell Encapsulation Machine from Fudahuakang Technology offers precise control, patented technology, a dedicated isothermal control system, and an intelligent tracing system for the encapsulation process. This effectively manages issues such as glue overflow, glue explosion, and air leakage, improving the consistency and yield rate of encapsulated chips.
Authoritative Certification: The key technology of Fudahuakang Technology’s chip package shell encapsulation equipment has been identified by a third-party appraisal agency as domestically advanced, with some functions reaching an internationally advanced level.
Business Inquiry:
Sales Manager: Liu Rongfu Mobile: 13929965156
Sales Manager: Lu Jianrong Mobile: 13929965158
Sales Manager: Liu Xifa Mobile: 13928506745